Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-06-30
1995-02-07
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257692, 257532, 257730, 257787, H01L 2316, H01L 2348
Patent
active
053878140
ABSTRACT:
A packaged integrated circuit device (2) has exposed contacts (8a, 8b) for electrical connection to terminals of an electrical component, such as a bypass capacitor (10), mounted externally from packaging material (4). The contacts (8a, 8b) are electrically connected to power and ground leads (6) extending from packaging material (4).
REFERENCES:
patent: 4598307 (1986-07-01), Wakabayashi et al.
Machine Design, "Novel method cuts IC packaging costs", Jan. 26, 1989, p. 40.
Baudouin Daniel
Russell Ernie
Wallace James
Brady III W. James
Donaldson Richard L.
Prenty Mark V.
Texas Instruments Incorporated
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