Integrated circuit with supports for mounting an electrical comp

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257692, 257532, 257730, 257787, H01L 2316, H01L 2348

Patent

active

053878140

ABSTRACT:
A packaged integrated circuit device (2) has exposed contacts (8a, 8b) for electrical connection to terminals of an electrical component, such as a bypass capacitor (10), mounted externally from packaging material (4). The contacts (8a, 8b) are electrically connected to power and ground leads (6) extending from packaging material (4).

REFERENCES:
patent: 4598307 (1986-07-01), Wakabayashi et al.
Machine Design, "Novel method cuts IC packaging costs", Jan. 26, 1989, p. 40.

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