Integrated circuit with step molded inner stacking module...

Details Integrated circuit with step molded inner stacking module... Integrated circuit with step molded inner stacking module...

2011-01-25

2011-01-25

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S787000, C257S786000, C257S777000, C257S783000, C257S723000, C257SE23123, C257SE23085, C257SE23126, C438S107000, C438S109000, C438S127000, C361S758000, C361S790000

Reexamination Certificate

active

07875967

ABSTRACT:
An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.

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