Integrated circuit with stacked-die configuration utilizing...

Details Integrated circuit with stacked-die configuration utilizing... Integrated circuit with stacked-die configuration utilizing...

2004-12-13

2008-07-15

Chu, Chris C. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE27161, C257S685000, C257S686000, C257S723000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

07400047

ABSTRACT:
An integrated circuit comprises a plurality of integrated circuit die arranged in a stack, with a given die other than a top die of the stack carrying current for itself and at least one additional die of the stack via substrate conduction. In one arrangement, each of the die other than a bottom die of the stack carries its power supply current by substrate conduction via a bus or other power supply conductor of an underlying die.

REFERENCES:
patent: 4947228 (1990-08-01), Gabara
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 5532512 (1996-07-01), Fillion et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 5973396 (1999-10-01), Farnworth
patent: 6031279 (2000-02-01), Lenz
patent: 6184585 (2001-02-01), Martinez et al.
patent: 6239495 (2001-05-01), Sakui et al.
patent: 6395630 (2002-05-01), Ahn et al.
patent: 6538333 (2003-03-01), Kong
patent: 6586266 (2003-07-01), Lin
patent: 6594153 (2003-07-01), Zu et al.
patent: 6624506 (2003-09-01), Sasaki et al.
patent: 6635970 (2003-10-01), Lasky et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 7030501 (2006-04-01), Yoshiba et al.
patent: 7129572 (2006-10-01), Wang
patent: 2002/0074637 (2002-06-01), McFarland
patent: 2005/0194674 (2005-09-01), Thomas et al.
patent: 2005/034238 (2005-04-01), None
“Integrated Circuit Packaging Glossary of Terms,” ECN Magazine (Nov. 2006).

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