Integrated circuit with self-aligned isolation

Details Integrated circuit with self-aligned isolation Integrated circuit with self-aligned isolation

1993-08-06

1995-03-07

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 62, 437 63, 437974, 148DIG50, 148DIG12, H04L 2176

Patent

active

053957890

ABSTRACT:
Integrated circuits are fabricated on a bonded wafer which has a buried silicide layer.

REFERENCES:
patent: 4307180 (1981-12-01), Pogge
patent: 4794445 (1988-12-01), Homma et al.
patent: 4952524 (1990-08-01), Lee et al.
patent: 5077234 (1991-12-01), Scoopo et al.
patent: 5098861 (1992-03-01), Blackstone
patent: 5102821 (1992-04-01), Moslehi
Semiconductor International pp. 72-74, "AT&T's Bipolar Process Is Best", K. G. Moerschei, T. Y. Chiu, et al. (Bipolar Series: Part 1).

Affiliated with

Also associated with

Rating

Integrated circuit with self-aligned isolation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit with self-aligned isolation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit with self-aligned isolation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1405801