Integrated circuit with offset pins

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S692000, C257SE23062, C257SE23070, C361S704000

Reexamination Certificate

active

07414308

ABSTRACT:
An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.

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patent: 6563223 (2003-05-01), Freeman
Datasheet for Telefunken, TCA 830, Telefunken, pp. 29-32; Mar. 16, 1998.

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