Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-12-07
2008-08-19
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000, C257SE23062, C257SE23070, C361S704000
Reexamination Certificate
active
07414308
ABSTRACT:
An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.
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Datasheet for Telefunken, TCA 830, Telefunken, pp. 29-32; Mar. 16, 1998.
Dreher Heiko
Hauser Wolfgang
Kimstedt Christian
Rogalla Markus
Le Dung A.
Micronas GmbH
O'Shea Getz P.C.
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