Patent
1979-01-15
1980-08-26
James, Andrew J.
357 52, 357 53, 357 65, H01L 2348, H01L 2944, H01L 2952
Patent
active
042198275
ABSTRACT:
An integrated circuit comprises a semiconductor body with a metal path running at least partially on the component side surface of the semiconductor body itself.
The invention also includes the method of making the arrangement.
REFERENCES:
patent: 3404304 (1968-10-01), Bonin et al.
patent: 3408542 (1968-10-01), Dautzenberg
patent: 3432731 (1969-03-01), Whittier
patent: 3436612 (1969-04-01), Grosvalet
patent: 3601668 (1971-08-01), Slaten
patent: 3602782 (1971-08-01), Klein
patent: 3771217 (1973-11-01), Hartman
patent: 3896486 (1975-07-01), Wright
patent: 3911473 (1975-10-01), Nienhuis
patent: 4000507 (1976-12-01), Nishida et al.
patent: 4041399 (1977-08-01), Tsuda
James Andrew J.
LICENTIA Patent-Verwaltungs-G.m.b.H.
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