Integrated circuit with low-loss primary conductor strapped...

Details Integrated circuit with low-loss primary conductor strapped... Integrated circuit with low-loss primary conductor strapped...

2007-09-18

2007-09-18

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S758000

Reexamination Certificate

active

10192476

ABSTRACT:
Techniques for “strapping” a primary conductor with a secondary conductor in an integrated circuit (IC). The IC includes a number of circuit elements interconnected by a secondary conductor through a number of vias disposed at a number of locations for coupling the circuit elements as an alternative to a primary conductor. The primary conductor is typically formed with a low loss metal (e.g., copper or copper alloy), and the secondary conductor is typically formed with a lossy metal (e.g., aluminum or aluminum alloy) relative to the low loss metal. The secondary conductor is strapped to the primary conductor by the vias, which may be disposed only at both ends or along the entire length of the secondary conductor. The secondary conductor is formed using design guidelines such that it provides the required electrical connectivity when the primary conductor is not present but minimally interferes with the RF performance of the primary conductor.

REFERENCES:
patent: 6207553 (2001-03-01), Buynoski et al.
patent: 6281108 (2001-08-01), Layman
patent: 6504252 (2003-01-01), Matsunaga
patent: 6710425 (2004-03-01), Bothra

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