Integrated circuit with low dielectric loss packaging material

Details Integrated circuit with low dielectric loss packaging material Integrated circuit with low dielectric loss packaging material

2007-11-27

2007-11-27

Mis, David (Department: 2817)

Oscillators

With frequency calibration or testing

C331S066000, C331S068000, C331S179000

Reexamination Certificate

active

11486945

ABSTRACT:
An integrated circuit package comprises an integrated circuit that comprises a temperature sensor that senses a temperature of the integrated circuit. A memory module stores data relating to oscillator calibrations and selects one of the oscillator calibrations as a function of the sensed temperature. An oscillator module generates a reference signal having a frequency that is based on the selected one of the oscillator calibrations. A packaging material encases at least part of the integrated circuit and has a low dielectric loss.

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