Integrated circuit with improved thermal impedance

Details Integrated circuit with improved thermal impedance Integrated circuit with improved thermal impedance

1994-08-31

1996-05-28

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Junction field effect transistor

257277, 333247, H01L 2348, H01L 2334

Patent

active

055214061

ABSTRACT:
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.

REFERENCES:
patent: 4959705 (1990-09-01), Lemnios et al.
patent: 5202752 (1993-04-01), Honjo
patent: 5319237 (1994-06-01), Legros
patent: 5352998 (1994-10-01), Tanino
W. S. Wong, W. D. Gray, and D. C. Wang, "Flip Chip Manufacturing Technology for GaAs MMIC," Hughes Aircraft Company, Microelectronic Circuits Division, 1993 GaAs Mantech, Conf., pp. 224-227.

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