Integrated circuit with improved immunity to large metallization

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365 63, 365164, 36518505, 36518533, G11C 502, G11C 506, G11C 1150, G11C 1134

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056445261

ABSTRACT:
The integrated circuit tolerant of large manufacturing defects comprising a first plurality of first conductors made of a first material with relatively low conductivity and each having a plurality of first electrical connection points arranged along itself and a second corresponding plurality of second conductors made of a second material with relatively high conductivity and each having a plurality of second electrical connection points arranged along itself and said plurality of first points are electrically connected to said plurality of second points respectively in such a manner as to reduce the series resistance of the first conductors and the second conductors are interrupted between some second consecutive points in such a manner as to leave relatively large areas of the integrated circuit not traversed by the second conductors.

REFERENCES:
patent: 4777387 (1988-10-01), Collins
patent: 4827449 (1989-05-01), Inoue
patent: 4833342 (1989-05-01), Kiryu et al.
patent: 5467316 (1995-11-01), Kim et al.

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