Integrated circuit with additional mini-pads connected by an...

Details Integrated circuit with additional mini-pads connected by an... Integrated circuit with additional mini-pads connected by an...

2011-04-05

2011-04-05

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to conductive state

C438S108000, C438S467000, C438S600000

Reexamination Certificate

active

07919363

ABSTRACT:
A semiconductor device includes a semiconductor chip. External connection pads and further pads are disposed over a surface of the semiconductor chip. Selected ones of the further pads are electrically connected to one another so as to activate selected functions within the semiconductor chip.

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