Integrated circuit with a chip on dot and a heat sink

Details Integrated circuit with a chip on dot and a heat sink Integrated circuit with a chip on dot and a heat sink

1997-07-21

1999-04-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361706, 361764, 361718, 257692, 257712, 257713, 438122, 174252, 174256, 174 163, 165 803, H05K 720

Patent

active

058962719

ABSTRACT:
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.

REFERENCES:
patent: 5045921 (1991-09-01), Howard et al.
patent: 5161090 (1992-11-01), Crawford et al.
patent: 5467251 (1995-11-01), Katchmar
patent: 5708566 (1998-01-01), Hunninghous et al.
patent: 5745984 (1998-05-01), Cole et al.
patent: 5792677 (1998-08-01), Reddy et al.

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