Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-03-22
2005-03-22
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S758000, C257S773000, C257S776000, C257S786000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000
Reexamination Certificate
active
06870255
ABSTRACT:
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.
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Fujimura Akira
Overhauser David
Teig Steven
Cadence Design Systems Inc.
Chu Chris C.
Eckert George
Stattler, Johansen and Adeli LLP
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