Integrated circuit wafer packaging system and method

Details Integrated circuit wafer packaging system and method Integrated circuit wafer packaging system and method

2004-06-03

2009-08-25

Pickett, J. Gregory (Department: 3728)

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

C206S521000, C206S832000

Reexamination Certificate

active

07578392

ABSTRACT:
A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.

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U.S. Appl. No. 60/476,790, filed Jun. 6, 2003, Brooks et al.
Letter from applicant disclosing documents he believes relevant to the application, 5 pages.
Attachment #1—confidentially and nondisclosure Agreement—3 pages.
Attachment #2 Manuel for Critical Packaging system—the system of the present invention.
Attachment #3—From U.S. Appl. No. 60/479,086, filed Jun. 17, 2003.
Attachment #5—Brooks box Invention demonstrated to Forsyth on May 5, 03.

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