Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Patent
1998-12-15
1999-10-05
Bowers, Charles
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
H01L 2100
Patent
active
059637790
ABSTRACT:
Integrated circuit architectures and methods of operation are provided that allow for the connection of a negative back-gate bias voltage to substrate contacts 24, 90, and 56 during burn-in operations. Accordingly, latch up conditions are prevented during burn-in operations when a circuit is especially vulnerable to such conditions and a grounded substrate is provided to allow for the most efficient operation of the circuit during normal conditions.
REFERENCES:
patent: 5528538 (1996-06-01), Sakura et al.
patent: 5633825 (1997-05-01), Sakura et al.
Dickerson Kenan J.
Leigh Anthony W.
McPherson Joe W.
Bowers Charles
Donaldson Richard L.
Laws Gerald E.
Marshall, Jr. Robert D.
Texas Instruments Incorporated
LandOfFree
Integrated circuit using a back gate voltage for burn-in operati does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit using a back gate voltage for burn-in operati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit using a back gate voltage for burn-in operati will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1182307