Integrated circuit thermal management method and apparatus

Details Integrated circuit thermal management method and apparatus Integrated circuit thermal management method and apparatus

2005-03-25

2008-10-21

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000

Reexamination Certificate

active

07439618

ABSTRACT:
An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.

REFERENCES:
patent: 6519154 (2003-02-01), Chiu
patent: 6829143 (2004-12-01), Russell et al.
patent: 7026711 (2006-04-01), Lee et al.

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