Integrated circuit thermal limit

Details Integrated circuit thermal limit Integrated circuit thermal limit

1988-09-08

1990-03-06

DeBoer, Todd E.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Load shunting by fault responsive means

361 86, 361103, 361106, 340484, H02H 900

Patent

active

049071173

ABSTRACT:
An integrated circuit is disclosed having a thermal shutdown capability. A single chip bonding pad is coupled to a circuit that will operate the bonding pad at a low potential for normal conditions and will pull it high when a temperature threshold is crossed. Thus, the normally low bonding pad provides a temperature flag. The bonding pad is also coupled to a latch that will hold it high and to a lockout circuit that acts to disable the heat producing chip circuitry. Therefore, when the bonding pad is once driven high the circuits are locked out and will remain out until a start up command is present. This is achieved by either momentarily removing the power supply or by pulling the bonding pad low. Both manual and computer control of the circuit is disclosed.

REFERENCES:
patent: 3916263 (1975-10-01), Abbott
patent: 4345218 (1982-08-01), Congdon et al.
patent: 4698655 (1987-10-01), Schultz

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