Integrated circuit testing board having constrained thermal expa

Details Integrated circuit testing board having constrained thermal expa Integrated circuit testing board having constrained thermal expa

1995-03-16

1997-02-11

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 3102

Patent

active

056024916

ABSTRACT:
A board (10) for testing an integrated circuit disposed on a semiconductor wafer. The board contains a plurality of substantially parallel signal layers (14) and power planes (16) that are supported and electrically isolated by a dielectric material (12). One or more constraint layers (18,20) are disposed in the dielectric material, and the constraint layers have a coefficient of thermal expansion of about 1-6 ppm/.degree.C. In a preferred embodiment, the dielectric material is a fluoropolymer with-a ceramic or silica filler, and the constraint layers are an iron-nickel alloy of about 30-40 percent nickel by weight. The board has thermal expansion characteristics substantially similar to silicon to ensure good contact to a silicon wafer during burn-in testing.

REFERENCES:
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patent: 4943468 (1990-07-01), Gordon et al.
patent: 5010389 (1991-04-01), Gansauge et al.
patent: 5195021 (1993-03-01), Ozmat et al.
patent: 5214566 (1993-05-01), Dupre et al.
patent: 5435057 (1995-07-01), Bindra et al.

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