Integrated circuit testing assembly and method

Details Integrated circuit testing assembly and method Integrated circuit testing assembly and method

1996-01-26

1997-10-21

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, 439 68, 439 91, G01R 3102, H05K 706

Patent

active

056800576

ABSTRACT:
An assembly and method for testing leads of an integrated circuit package. The assembly includes a testing substrate with a plurality of conductive portions for use in connection with a test probe. The assembly further includes at least one compressible conductive bridge member for providing electrical contact between the leads of the integrated circuit package and the conductive portions of the testing substrate. The conductive bridge member has multiple electrically conductive wires embedded therein or secured thereto, each of the wires being parallel to one another and spaced apart from one another. The assembly uses a locator device for retaining the conductive bridge members therein and maintaining the conductive bridge members in electrical contact with the leads of the integrated circuit package and the conductive portions of the testing substrate.

REFERENCES:
patent: 3862790 (1975-01-01), Davies et al.
patent: 4003621 (1977-01-01), Lamp
patent: 4504783 (1985-03-01), Zasio et al.
patent: 4593961 (1986-06-01), Cosmo
patent: 4766371 (1988-08-01), Moriya
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4843313 (1989-06-01), Walton
patent: 4874318 (1989-10-01), Spencer
patent: 4954878 (1990-09-01), Fox et al.
patent: 5005070 (1991-04-01), Altendorf et al.
patent: 5014161 (1991-05-01), Lee et al.
patent: 5049813 (1991-09-01), Van Loan et al.
patent: 5092034 (1992-03-01), Altendorf et al.
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5124660 (1992-06-01), Cilingiroglu
patent: 5140405 (1992-08-01), King et al.
patent: 5155302 (1992-10-01), Nguyen
patent: 5206585 (1993-04-01), Chang et al.
patent: 5247246 (1993-09-01), Van Loan et al.
patent: 5247250 (1993-09-01), Rios
1993 Pomona Surface Mount & IC Test Accessories catalog of ITT Pomona Electronics, 1500 E. Ninth St., Pomona, CA 91769.
"ShinEtsu Inter-Connector General Guide" by Fijipoly, Inc., 750 Walnut Ave., Cranford, NJ 07016 (7 pages).

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