Integrated circuit test fixture and method

Details Integrated circuit test fixture and method Integrated circuit test fixture and method

1990-06-29

1993-03-30

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, 165 804, G01R 3500, G01R 3106

Patent

active

051987538

ABSTRACT:
A test fixture (10) for integrated circuits includes a wafer chuck (12). The chuck (12) has a plurality of concentrically arranged vacuum hold down rings (14) which communicate with top (18) of the chuck (12). Between the hold down rings (14) are a plurality of concentrically arranged helium gas supply rings (20), connected to a source of helium gas (22), and also communicating with top (18) of the chuck (12). An integrated circuit wafer (24) is mounted on the top (18) of the chuck (12), held in place by the vacuum hold down rings (14). Helium has a thermal conductivity five times that of air. Flow of helium gas in the helium supply rings (20) between the wafer (24) and the chuck (12) therefore reduces the interface thermal resistance between the wafer (24) and the chuck (12) as much as five times. A coolant supply tube (32) extends through the probe card (26), terminating proximate to the wafer (24), and is connected to a source of coolant (33), to assist the cooling.

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Perry; "Measurement of Physical and Chemical Characteristics"; Chemical Engineers' handbook; p. 1303; 1950.
IBM Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1988, pp. 462-464, "Electrostatic Wafer Holder for Wafer Cooling During Reactive Ion Etching".

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