Integrated circuit system with clean surfaces

Coating processes – With pretreatment of the base – Etching – swelling – or dissolving out part of the base

Reexamination Certificate

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C427S299000, C427S314000, C134S026000, C134S028000

Reexamination Certificate

active

07968148

ABSTRACT:
An integrated circuit system includes providing an integrated circuit wafer; applying a first cleaning solution over the integrated circuit wafer; and applying a second cleaning solution over the integrated circuit wafer to prevent or remove a defect resulting from the first cleaning process.

REFERENCES:
patent: 4264374 (1981-04-01), Beyer et al.
patent: 5803980 (1998-09-01), Pas et al.
patent: 6132522 (2000-10-01), Verhaverbeke et al.
patent: 6713353 (2004-03-01), Kanda et al.
patent: 6821854 (2004-11-01), Kanda et al.
patent: 7084048 (2006-08-01), Shive et al.
patent: 2004/0209441 (2004-10-01), Maleville et al.
patent: 2005/0116360 (2005-06-01), Huang et al.
patent: 2005/0236626 (2005-10-01), Takafuji et al.
patent: 2006/0246217 (2006-11-01), Weidman et al.
patent: 2006/0264043 (2006-11-01), Stewart et al.
S. Wolf ( Silicon Processing for the VLSI Era, vol. 4-Deep Submicron Process Technology, Lattice Press, 2002. pp. 573-578).

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