Integrated circuit system with a latent heat storage module

Details Integrated circuit system with a latent heat storage module Integrated circuit system with a latent heat storage module

2005-11-08

2005-11-08

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S717000, C257S714000, C257S715000, C257S716000, C257S720000, C257S721000, C257S723000, C257S722000, C257S728000, C257S724000, C257S725000, C257S729000, C257S731000, C257SE23089, C428S307300, C428S913000, C428S319100, C428S319300, C165S010000, C165S080300, C062S003200, C062S259200, C062S003700, C062S185000, C062S435000, C062S434000, C062S439000

Reexamination Certificate

active

06963131

ABSTRACT:
The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

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