Integrated circuit substrate with cooling accelerator substrate

Details Integrated circuit substrate with cooling accelerator substrate Integrated circuit substrate with cooling accelerator substrate

1993-12-16

1995-04-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

054037832

ABSTRACT:
An electronic device includes an integrated circuit device, the integrated circuit device comprises a first substrate including an integrated electronic semiconductor circuit and a second substrate including a cooling accelerator for accelerating a heat energy exchange between the integrated electronic semiconductor circuit and a cooling fluid, and the second substrate is joined fixedly with the first substrate through a covalent bond formed between the first substrate and the second substrate.

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Tuckerman, D. B. et al. "High-Performance Heat Sinking for VLSI," IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981, pp. 126-129. (English).
Tuckerman, D. B., et al. "Microcapillary Thermal Interface Technology for VLSI Packaging," Symposium on VLSI Technology, Digest of Technical Paper (3rd), Sep. 1983 (Maui). (English).

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