Integrated circuit structure with fully enclosed air isolation

Details Integrated circuit structure with fully enclosed air isolation Integrated circuit structure with fully enclosed air isolation

1976-09-02

1978-08-08

Miller, Jr., Stanley D.

H01L 2704

Patent

active

041060504

ABSTRACT:
An integrated circuit member structure comprising a semiconductor substrate having formed therein a pattern of cavities extending from one surface of the substrate into the substrate and fully enclosed within said member, a plurality of pockets of semiconductor material extending from said substrate laterally surrounded and electrically insulated by said cavities and a planar layer of electrically insulative material on said surface.

REFERENCES:
patent: 3332137 (1967-07-01), Kenney
patent: 3489961 (1970-01-01), Frescura et al.
patent: 3513022 (1970-05-01), Casterline et al.
patent: 3647585 (1972-03-01), Fritzinger et al.
patent: 3689992 (1972-09-01), Schutze et al.
patent: 3787710 (1974-01-01), Cunningham
patent: 3905037 (1975-09-01), Bean et al.

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