Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1976-08-30
1978-01-31
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29580, 357 51, B01J 1700
Patent
active
040707482
ABSTRACT:
A semiconductor integrated circuit which is reduced in size by having active and/or passive elements in an epitaxial layer having a [100] crystallographic surface, and having anisotropically etched regions with sloped [111] crystallographic surface walls which isolate adjacent semiconductor elements and/or regions of semiconductor material beneath said elements. Conductors interconnecting said elements are supported on the [100] and [111] crystallographic surfaces and contact said elements and/or said high conductivity regions through apertures in surface passivating protective coatings on said surfaces.
REFERENCES:
patent: 3623218 (1971-11-01), Mitarai
patent: 3768150 (1973-10-01), Sloan
Legat Wilhelm H.
Taft Keith G.
Tiefert Karl H.
Bartlett Milton D.
Pannone Joseph D.
Raytheon Company
Tupman W.
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