Integrated circuit structure having reduced cross-talk and metho

Details Integrated circuit structure having reduced cross-talk and metho Integrated circuit structure having reduced cross-talk and metho

1996-07-24

1997-11-18

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257758, 257786, H01L 23522, H01L 23552

Patent

active

056891342

ABSTRACT:
An integrated circuit structure is described having a non-metallic electrically conductive plate preferably placed over an insulating layer formed over the uppermost layer of metal lines. The electrically conductive non-metallic plate is operative to terminate electric field lines emanating from at least some of the metal lines in the metal layers under the insulating layer beneath the non-metallic electrically conductive plate, particularly the uppermost metal lines, i.e., those spaced the farthest distance from the underlying semiconductor substrate. The conductive plate may be connected to either a ground line or a power line. In another embodiment, the non-metallic electrically conductive plate may be located between at least the uppermost layer of metal lines and one or more lower layers of metal lines, with insulating layers separating the non-metallic electrically conductive plate from such metal lines.

REFERENCES:
patent: 4622576 (1986-11-01), Buynoski
patent: 4958222 (1990-09-01), Takakura et al.
patent: 4984200 (1991-01-01), Saitoo et al.
patent: 5060045 (1991-10-01), Onada et al.
patent: 5262353 (1993-11-01), Sun et al.
patent: 5300814 (1994-04-01), Matsumoto et al.
patent: 5428242 (1995-06-01), Furuya et al.

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