Integrated circuit structure having conductive, protective layer

Details Integrated circuit structure having conductive, protective layer Integrated circuit structure having conductive, protective layer

1985-04-12

1987-06-09

James, Andrew J.

357 67, 357 61, H01L 2314, H01L 2354

Patent

active

046724206

ABSTRACT:
An improved integrated circuit structure, and method of making the structure, is disclosed wherein at least one metallization layer is coated during production of the structure with a conductive layer capable of withstanding metal removal means, and an upper metallization layer is subsequently applied to the structure. At least a portion of the subsequent metallization layer is in ohmic contact with the conductive layer and the lower metallization layer is protected by the intervening conductive layer during subsequent removal of the upper metallization layer if subsequent reworking of the structure becomes necessary. In a preferred embodiment, the use of the conductive layer over a metallization layer further enhances the construction process during patterning of a photoresist applied over the conductive layer by the use of a conductive material having antireflective properties.

REFERENCES:
patent: 3385731 (1968-05-01), Weimer
patent: 4267012 (1981-05-01), Pierce et al.

Affiliated with

Also associated with

Rating

Integrated circuit structure having conductive, protective layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit structure having conductive, protective layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit structure having conductive, protective layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1832484