Integrated circuit stacking system with integrated passive...

Details Integrated circuit stacking system with integrated passive... Integrated circuit stacking system with integrated passive...

2006-10-04

2010-12-14

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S238000, C438S382000, C438S393000, C257S724000, C257S678000

Reexamination Certificate

active

07851257

ABSTRACT:
An integrated circuit stacking system is provided including fabricating an integrated passive device including: providing a semiconductor substrate, forming an integrated inductor, a resistor block, or an integrated capacitor integrated on the semiconductor substrate, and forming contact pads, on the semiconductor substrate, coupled to the integrated inductor, the resistor block, or the integrated capacitor; positioning an integrated circuit die for maintaining an inductor spacing; mounting the integrated circuit die on the integrated passive device; and encapsulating the integrated circuit die and the integrated passive device.

REFERENCES:
patent: 5370766 (1994-12-01), Desaigoudar et al.
patent: 5446311 (1995-08-01), Ewen et al.
patent: 5478773 (1995-12-01), Dow et al.
patent: 6075427 (2000-06-01), Tai et al.
patent: 6180445 (2001-01-01), Tsai
patent: 6294420 (2001-09-01), Tsu et al.
patent: 6534374 (2003-03-01), Johnson et al.
patent: 6636139 (2003-10-01), Tsai et al.
patent: 6761963 (2004-07-01), Casper et al.
patent: 6900708 (2005-05-01), White et al.
patent: 6933614 (2005-08-01), Lee et al.
patent: 7068139 (2006-06-01), Harris et al.
patent: 7084515 (2006-08-01), Fuller et al.
patent: 2003/0219956 (2003-11-01), Mori et al.
patent: 2004/0007778 (2004-01-01), Shinozaki et al.
patent: 2005/0017361 (2005-01-01), Lin et al.
patent: 2005/0054155 (2005-03-01), Song et al.
patent: 2005/0093095 (2005-05-01), Yamagata
patent: 2005/0127393 (2005-06-01), Kurokawa
patent: 2005/0212106 (2005-09-01), Kwon et al.
patent: 2005/0253255 (2005-11-01), Degani et al.
patent: 2007/0231251 (2007-10-01), Itsuki et al.
patent: 2007/0235878 (2007-10-01), Lin et al.

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