Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2009-02-19
2011-11-01
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S724000, C257SE23169
Reexamination Certificate
active
08049320
ABSTRACT:
A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.
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“SiP: System in Package,” [online] Carsem, [retrieved on Feb. 17, 2009], retrieved from the Internet: <http://www.carsem.com/services/Drugs&Data/ds—sip.pdf>.
Harper Peter R.
Maggio Kenneth
Brady III Wade J.
Parekh Nitin
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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