Integrated circuit spring contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

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Details

257696, 257692, 257719, 257726, H01L 2348, H01L 3902

Patent

active

056635966

ABSTRACT:
An integrated-circuit interconnect which can be formed at the wafer level is achieved by depositing an intentionally stressed contact layer over a release layer which is subsequently removed. The removal of the release layer permits a portion of the contact layer to curve away from the surface of an integrated chip. The result is a spring contact having a base portion joined to a member of the chip and a spring portion which is available for joining of other metal members, e.g., on a substrate or another chip. The resilience of the spring portion can also be used to position and align integrated circuit elements.

REFERENCES:
patent: 4203129 (1980-05-01), Oktay et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5166774 (1992-11-01), Banerji et al.
patent: 5367195 (1994-11-01), DiGiacomo et al.
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5518964 (1996-05-01), DiStefano et al.

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