Integrated circuit spring contact fabrication methods

Details Integrated circuit spring contact fabrication methods Integrated circuit spring contact fabrication methods

1995-12-21

1997-09-09

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

438654, 438666, H01L 2160

Patent

active

056656483

ABSTRACT:
An integrated-circuit interconnect which can be formed at the wafer level is achieved by depositing an intentionally stressed contact layer over a release layer which is subsequently removed. The removal of the release layer permits a portion of the contact layer to curve away from the surface of an integrated circuit chip. The result is a spring contact having a base portion joined to a metal member of the chip and a spring portion which is available for joining to other metal members, e.g., on a substrate or another chip. The resilience of the spring portion can also be used to position and align integrated circuit elements.

REFERENCES:
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5518964 (1996-05-01), DiStefano et al.

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