Integrated circuit solder-rack interconnect module

Details Integrated circuit solder-rack interconnect module Integrated circuit solder-rack interconnect module

1997-09-29

1998-09-15

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174263, 228175, 361719, 439 66, H05K 720

Patent

active

058088750

ABSTRACT:
An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

REFERENCES:
patent: 3872583 (1975-03-01), Beall
patent: 4646435 (1987-03-01), Grassauer
patent: 5222014 (1993-06-01), Lin
patent: 5237743 (1993-08-01), Busacco
patent: 5473510 (1995-12-01), Dozier, II
patent: 5477933 (1995-12-01), Nguyen
patent: 5541450 (1996-07-01), Jones
patent: 5553769 (1996-09-01), Ellerson

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