Integrated circuit solder ball implant machine

Details Integrated circuit solder ball implant machine Integrated circuit solder ball implant machine

1997-06-25

1999-07-13

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

228246, 118213, B23K 3006, H01L 2106

Patent

active

059214589

ABSTRACT:
The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device. Furthermore, when the ball implant device moves upward during utilization, the module of the aforesaid integrated circuit component positioning device is capable of horizontal movement, and thereby enables the integrated circuit component to be lifted out by the mold ejection device at a set position at the completion of the solder ball implantation onto the integrated circuit component in an operation that is simple, convenient and rapid.

REFERENCES:
patent: 4142286 (1979-03-01), Knuth et al.
patent: 4203698 (1980-05-01), Dupuis
patent: 4206542 (1980-06-01), Reavill
patent: 4733520 (1988-03-01), Rabbi
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5176289 (1993-01-01), Klossner et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5704536 (1998-01-01), Chen et al.
patent: 5782399 (1998-07-01), Lapastora
patent: 5839641 (1998-11-01), Teng

Affiliated with

Also associated with

Rating

Integrated circuit solder ball implant machine does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit solder ball implant machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit solder ball implant machine will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2268674