Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1986-06-09
1987-09-22
Weidenfeld, Gil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439389, 439869, 439488, H01R 1305, H01R 909
Patent
active
046951075
ABSTRACT:
A novel integrated circuit socket provides splash-preventing capillary action improving half-round section pins that seat better by means of a conical longitudinal shape that wedges in holes in conventional printed circuit boards. The pins have P.C. board top-track contacting spurs at an upper portion that serve two purposes: they improve capillary action and they reduce bellying (i.e. flexing) of the I.C. socket during assembly to the P.C. Board. The invention provides improved visibility by co-action of transparent material of which the I.C. socket is made, with a plurality of Fresnel lenses molded in the bottom surface of the I.C. socket.
REFERENCES:
patent: 3103547 (1963-09-01), Ansley
patent: 3145069 (1964-08-01), Damon et al.
patent: 3428934 (1969-02-01), Reider, Jr. et al.
patent: 3524161 (1970-08-01), Frantz et al.
patent: 3543215 (1970-11-01), Jones
patent: 4178061 (1979-12-01), Ahroni
"Component Mounting and Wire Wrapping Contact", IBM Tech. Disclosure Bulletin, vol. 5, No. 5, Oct. 1962, 339/17C.
McClellan, Sr. John F.
Pauman Gary F.
Weidenfeld Gil
LandOfFree
Integrated circuit sockets does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit sockets, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit sockets will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2054621