Integrated circuit sockets

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Patent

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Details

439389, 439869, 439488, H01R 1305, H01R 909

Patent

active

046951075

ABSTRACT:
A novel integrated circuit socket provides splash-preventing capillary action improving half-round section pins that seat better by means of a conical longitudinal shape that wedges in holes in conventional printed circuit boards. The pins have P.C. board top-track contacting spurs at an upper portion that serve two purposes: they improve capillary action and they reduce bellying (i.e. flexing) of the I.C. socket during assembly to the P.C. Board. The invention provides improved visibility by co-action of transparent material of which the I.C. socket is made, with a plurality of Fresnel lenses molded in the bottom surface of the I.C. socket.

REFERENCES:
patent: 3103547 (1963-09-01), Ansley
patent: 3145069 (1964-08-01), Damon et al.
patent: 3428934 (1969-02-01), Reider, Jr. et al.
patent: 3524161 (1970-08-01), Frantz et al.
patent: 3543215 (1970-11-01), Jones
patent: 4178061 (1979-12-01), Ahroni
"Component Mounting and Wire Wrapping Contact", IBM Tech. Disclosure Bulletin, vol. 5, No. 5, Oct. 1962, 339/17C.

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