Integrated circuit socket with built in EMC grounding for a heat

Details Integrated circuit socket with built in EMC grounding for a heat Integrated circuit socket with built in EMC grounding for a heat

1998-04-28

2000-06-06

Donovan, Lincoln

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

361704, H01R 909

Patent

active

060711280

ABSTRACT:
An integrated circuit socket 41 with built in EMC grounding for a heat sink 16 is provided. The socket 41 may be used with an electronic assembly 10 packaged with or without a planar card 20. The socket 41 includes or accepts one or more conductive fingers 53. The conductive fingers 53 are designed to extend down from the lug 81 of the socket 41 and form a pin. The socket body 41 may have two opposed side walls 71. Each side wall has a lug 81 that projects laterally out from the wall 71. A surface of each lug is coated or covered with a conductive material which forms the conductive finger 53. Each finger forms a pin which extends down from the socket 41 like other socket pins 50. Alternatively, the EMC fingers 55 are electrically coupled to one or more of the socket pins 50 via conductive traces 91/93. A curved upper portion of the finger 53/55 is designed to fit within the lug 81 such that solid electrical contact with the retainer clip 19 is maintained. The finger 53/55 electrically couples the ground plane of the planar card 20 to the heat sink 16 via the retainer clip 19.

REFERENCES:
patent: 5031028 (1991-07-01), Galich et al.
patent: 5495392 (1996-02-01), Shen
patent: 5541811 (1996-07-01), Henningsson et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5600540 (1997-02-01), Blomquist
patent: 5602719 (1997-02-01), Kinion
Intel "Pentium.RTM. Processor with MMX.TM. Technology", Jun. 1997 #243185.004.

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