Integrated circuit socket for ball grid array and land grid arra

Details Integrated circuit socket for ball grid array and land grid arra Integrated circuit socket for ball grid array and land grid arra

1994-09-28

1998-02-03

Bradley, P. Austin

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

H01R 909

Patent

active

057137447

ABSTRACT:
Injection molded insulating strips receive a plurality of contacts. The strips are stacked together to create a multiple row, multiple column contact array. The contact array is adapted for use in an IC socket to separably connect an IC having either an LGA or BGA package lead styles. A cover plate, locator, array frame, and contact array together comprise a manufacturable and low cost separable IC socket.

REFERENCES:
patent: 3680032 (1972-07-01), Mosier et al.
patent: 3740699 (1973-06-01), Johnson et al.
patent: 3848951 (1974-11-01), Michaels et al.
patent: 3975076 (1976-08-01), Shida et al.
patent: 3980376 (1976-09-01), Rosen
patent: 4067637 (1978-01-01), Narozny
patent: 4129351 (1978-12-01), Sugimoto et al.
patent: 4262981 (1981-04-01), Goodman
patent: 4343528 (1982-08-01), Lucius et al.
patent: 4385795 (1983-05-01), Endoh et al.
patent: 4390220 (1983-06-01), Benasutti
patent: 4580867 (1986-04-01), Wright et al.
patent: 4585288 (1986-04-01), Aikens
patent: 4632478 (1986-12-01), Kozai et al.
patent: 4647124 (1987-03-01), Kandybowski
patent: 4656605 (1987-04-01), Clayton
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4727513 (1988-02-01), Clayton
patent: 4790763 (1988-12-01), Weber et al.
patent: 4820169 (1989-04-01), Weber et al.
patent: 4846729 (1989-07-01), Hikami et al.
patent: 4917614 (1990-04-01), Kikuchi et al.
patent: 4969842 (1990-11-01), Davis
patent: 4990107 (1991-02-01), Fortuna
patent: 4998886 (1991-03-01), Werner
patent: 5057032 (1991-10-01), Kaufman et al.
patent: 5082459 (1992-01-01), Billman et al.
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 5197891 (1993-03-01), Tanigawa et al.
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5216583 (1993-06-01), Katsumata
patent: 5233451 (1993-08-01), Iguchi
patent: 5259793 (1993-11-01), Yamada et al.
patent: 5259795 (1993-11-01), Yamada et al.
patent: 5263870 (1993-11-01), Billman et al.
patent: 5344334 (1994-09-01), Laub et al.

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