Integrated circuit socket comprising a polyimide polymer

Details Integrated circuit socket comprising a polyimide polymer Integrated circuit socket comprising a polyimide polymer

1989-12-19

1993-04-27

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

524606, 524608, 528125, 528128, 528171, 528172, 528173, 528183, 528185, 528188, 439 55, C08G 6926, C08G 802, C08G 7500, C08J 6702

Patent

active

052063402

ABSTRACT:
Integrated circuit sockets for use in a burn-in test are disclosed. The IC sockets are produced by injection molding of a specific polyimide having an inherent viscosity of 0.35 to 0.65 dl/g and essentially consisting of recurring units represented by the formula (I): ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon having from 1 to 10 carbon atoms, etc. and R is a tetravalent radical selected from the group consisting of an aliphatic radical having two or more carbon atoms, cycloaliphatic radical, monoaromatic radical etc.

REFERENCES:
patent: 4410231 (1983-10-01), Senor
patent: 4722060 (1988-01-01), Quinn et al.
patent: 4795798 (1989-01-01), Tamai et al.
patent: 4838799 (1989-06-01), Tonooka
patent: 4847349 (1989-07-01), Ohta et al.
Chemical Abstracts, vol. 77, No. 12, 18 Sep. 1972, p. 51, Abstract No. 7617x, "Materials for High Temperature Integrated Circuit Testing", pp. 86-92.

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