Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1987-08-19
1989-05-16
Pirlot, David
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439525, 439 76, H01R 100
Patent
active
048306223
ABSTRACT:
An assembly for testing integrated packages comprising, a test circuit board for simultaneously testing a plurality of integrated circuit packages with each package having a plurality of rows of leads extending in parallel array from the body of the package, the board having a plurality of sockets each shaped with a top, sidewalls and a bottom with the top having means forming a plurality of rows of depending recesses spaced to receive, one each, the leads, and also having a plurality of auxiliary recesses, each positioned within the sidewalls and each shaped to receive a discrete component and each associated with one of the depending lead recesses, and means for electrically connecting discrete components within the auxiliary recesses and integrated circuit package leads in the associated depending lead recesses to each other and through the sockets to the circuit board, each discrete component being electrically connected to no more than one of the circuit package leads.
REFERENCES:
patent: 3622950 (1971-11-01), Millinger
patent: 4192565 (1980-03-01), Gianni
patent: 4312555 (1982-01-01), Donaher et al.
patent: 4326765 (1982-04-01), Brancelone
patent: 4428633 (1984-01-01), Lundergan et al.
patent: 4460236 (1984-07-01), Strauss
patent: 4478476 (1984-10-01), Jones
Erickson George
Rindone, Sr. Louis
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