Geometrical instruments
Patent
1985-09-09
1986-10-14
Abrams, Neil
Geometrical instruments
339 91R, H01R 13627
Patent
active
046168958
ABSTRACT:
An integrated circuit (IC) socket comprising: a box-shaped housing of dielectric material open at the upper side thereof and having a recess for receiving a leadless chip carrier type of IC device; a plurality of contacts for contacting the electrodes of the IC device within the recess, each of the contacts comprising a springy conductive member and being disposed in the bottom of the housing so as to contact the electrodes formed in the bottom surface of the IC device; and two pairs of pressing members arranged at opposite corners for holding the IC device within the recess, each member comprising a springy member and a projection formed at the top end of the springy member for pressing the IC device. The projections on the pressing members are semicircular-shaped to permit easy insertion and removal, and to maintain downward pressure.
REFERENCES:
patent: 3892312 (1975-07-01), Tems
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4070081 (1978-01-01), Takahashi
patent: 4330163 (1982-05-01), Aikens et al.
patent: 4331373 (1982-05-01), Demnianiuk
patent: 4401352 (1983-08-01), Heisey
Computer, vol. 10, No. 12, Dec., 1977, Long Beach, J. W. Balde et al., "New Chip Carrier Package Concepts", pp. 58-68.
Ishii Toshimasa
Yoshizaki Tsutomu
Abrams Neil
Fujitsu Limited
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