Integrated circuit silicon pressure transducer package

Details Integrated circuit silicon pressure transducer package Integrated circuit silicon pressure transducer package

1988-12-12

1990-05-15

Reynolds, Bruce A.

Electrical resistors

Resistance value responsive to a condition

Fluid- or gas pressure-actuated

338 5, 338 42, H01L 1010

Patent

active

049261550

ABSTRACT:
A sensor chip subassembly for use in a transducer assembly includes a support member to which a pressure sensitive chip is elastically bonded at predetermined but spaced points to separate the chip from direct contact with the support member. The separation minimizes vibration and stress from being transmitted from the support member to the chip.

REFERENCES:
patent: 4017819 (1977-04-01), Pien
patent: 4291293 (1981-09-01), Yamada et al.
patent: 4523964 (1985-06-01), Wilner et al.
patent: 4528855 (1985-07-01), Singh
patent: 4596155 (1986-06-01), Kistler
patent: 4675643 (1987-06-01), Tanner et al.

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