Integrated circuit scribe line structures and methods for making

Details Integrated circuit scribe line structures and methods for making Integrated circuit scribe line structures and methods for making

1993-12-30

1997-11-11

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 428688, B32B 900

Patent

active

056861710

ABSTRACT:
A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

REFERENCES:
patent: 5017512 (1991-05-01), Takagi
patent: 5157001 (1992-10-01), Sakama
patent: 5300816 (1994-04-01), Lee

Affiliated with

Also associated with

Rating

Integrated circuit scribe line structures and methods for making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit scribe line structures and methods for making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit scribe line structures and methods for making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1227249