Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-04-02
1993-09-14
Cuda, Irene
Metal working
Method of mechanical manufacture
Electrical device making
29530, 29855, 437212, 437219, 437224, 26427212, H05K 300
Patent
active
052437566
ABSTRACT:
A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections. In addition, the low viscosity of the liquid substantially prevents stress on the bond wires. To confine the liquid and prevent void formation, a coating is positioned over the exposed region of the liquid. A cover may be positioned over the cavity to further protect the integrated circuit.
REFERENCES:
patent: 4123308 (1978-10-01), Nowlin et al.
patent: 4847731 (1989-07-01), Smolley
patent: 4874915 (1989-10-01), Harms
patent: 5037779 (1991-08-01), Whalley et al.
patent: 5121706 (1992-06-01), Nichols et al.
Fitch John S.
Hamburgen William R.
Cuda Irene
Digital Equipment Corporation
Hansen Kenneth J.
LandOfFree
Integrated circuit protection by liquid encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit protection by liquid encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit protection by liquid encapsulation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2019403