Integrated circuit product having a polyimide film interconnecti

Details Integrated circuit product having a polyimide film interconnecti Integrated circuit product having a polyimide film interconnecti

1987-07-13

1989-12-26

Hille, Rolf

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 12, 174 685, 430313, H01L 2308

Patent

active

048901571

ABSTRACT:
A method for making integrated circuits in which a polyimide/conductor multilevel film (17) in cast on a substrate (10), using available or existing semiconductor processing equipment. The polyimide film (17) is formed from readily available polyamic acid resins, and the conductor (16) can be sputtered aluminum formed to interconnection conductor patterns (16,16-) by standard photolithographic techniques. After fabrication of the multilayer film (17), the conductors (16,16') of the film (17) and the device circuit (30) are brought into aligned contact, and the device circuit (30) affixed to the film (17). The film (17) and the device circuit (30) are then removed from the substrate (10) for further processing, such as bonding the device and film to a mother board or leadframe, as desired.

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patent: 4654223 (1987-03-01), Araps et al.
patent: 4680617 (1987-07-01), Ross
patent: 4710798 (1987-12-01), Marcantonio
EPA-A-0 114 211, (IBM).

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