Integrated circuit processing

Details Integrated circuit processing Integrated circuit processing

1997-09-03

1999-12-21

Dutton, Brian

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Interconnecting plural devices on semiconductor substrate

438 10, 438 17, H01L 2100, H01L 2166, G01R 3126

Patent

active

060048271

ABSTRACT:
A variety of test structures may be fabricated with aluminum runners and overlying dielectrics. The dielectrics are removed and bumps are observed upon the aluminum runners. Unevenness in the bump distribution is a predictor of long term reliability problems. A test structure may be utilized to design integrated mass production fabrication processes.

REFERENCES:
patent: 3548491 (1970-12-01), Ainslie et al.

Affiliated with

Also associated with

Rating

Integrated circuit processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit processing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-504259