Integrated circuit process

Details Integrated circuit process Integrated circuit process

1973-06-28

1976-05-04

Rutledge, L. Dewayne

Metal treatment

Process of modifying or maintaining internal physical...

Chemical-heat removing or burning of metal

29577, 29580, 148174, 148191, 357 44, 357 49, 357 50, 357 59, 156600, H01L 2176, H01L 2904

Patent

active

039545229

ABSTRACT:
In the manufacture of semiconductor components, more radiation tolerant semiconductors are accomplished by growing a uniform epitaxial collector region on a dielectrically isolated substrate having islands of high conductivity semiconductor material.

REFERENCES:
patent: 3454835 (1969-07-01), Rosvold
patent: 3587166 (1971-06-01), Alexander et al.
patent: 3725146 (1973-04-01), Roder
Wu, B. P. F., "Semiconductor Fabrication... of Integrated Circuits", I.B.M. Tech. Discl. Bull., Vol. 8, No. 12, May 1966, pp. 1846-1847.
Stern, E., "Planar Scanistor Arrays", Ibid., Vol. 7, No. 11, Apr. 1965, pp. 1101-1102.
Stern et al., "Fabrication of Planar... By Insulating Barriers", Ibid., Vol. 7, No. 11, Apr. 1965, p. 1103.
Thornton, C. G., "Metal Bathtubs in Microcircuits Reduce Collector Resistance", Electronic Equipment Engin. Dec. 1964, pp. 18-20.

Affiliated with

Also associated with

Rating

Integrated circuit process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-676121