Integrated circuit power net analysis

Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system – Power system

Reexamination Certificate

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Details

C703S019000, C716S030000, C716S030000

Reexamination Certificate

active

06311147

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to computer-aided design (CAD) tools for analyzing integrated circuits and, more particularly, to analyzing power Vdd and ground nets in integrated circuits for electromigration, voltage drop and ground bounce.
Aggressive development within the semiconductor industry keeps electronic products moving on a brisk course forward. With each new generation of integrated circuit (IC) chips, device geometries and supply voltages are decreasing while the clock frequencies are increasing. Typical ICs today contain more than three million transistors and include three to five layers of metal interconnects that supply power and transport signals.
Along with smaller device geometries come narrower metal lines and larger resistances. Also, as more devices are interconnected, the lines are getting longer, further increasing the interconnect resistance. The substantial voltage drops that develop across metal power nets cause the circuits to malfunction, especially when the supply voltage is reduced below 3 volts. For example, a 1 volt drop in a 3 volt system would have a much more severe impact on circuit functionality than a proportional drop in a 5 volt system. So, in deep submicrometer designs (feature sizes less than 0.5 &mgr;M), voltage drop analysis is crucial. Additionally, the narrower metal lines have undesirable wear-out of metal wiring caused by electromigration.
Ground bounce is due to the inductance in the IC package pins and bonding wires and the current switching (dI/dt) in the integrated circuit. Ground bounce noise may affect circuits in various ways. For example, ground bounce noise may degrade the performance of the circuit. Additionally, ground bounce noise may cause the circuit to malfunction due false latching in receiving chips.
In deep submicron design, the circuit consumes more power which means that dI/dt is even greater than in nonsubmicron designs. The ground bounce problem in the past was more significant in output buffers than on-chip circuits. However, the ground bounce noise in on-chip circuits is becoming more important with today's technologies.
Numerous CAD tools exist for simulating transistor networks of ICs (e.g., SPICE). An innovative system is described in U.S. patent application Ser. No. 08/040,531, entitled “Transistor-Level Timing and Power Simulator and Power Analyzer”, filed Mar. 29, 1993 by Huang et al., and U.S. patent application Ser. No. 08/231,207, entitled “Power Diagnosis for VLSI Designs”, filed Apr. 21, 1994 by An-Chang Deng, which are both hereby incorporated by reference for all purposes. However, none of the prior art systems allow the user to simulate the power nets of an IC and display power net characteristics like voltage drop, current density and ground bounce. The present invention fulfills this and other needs.
SUMMARY OF THE INVENTION
The present invention provides methods for analysis of power nets of integrated circuits. In a preferred embodiment, a system of the present invention includes a transistor network simulator and a power net simulator. The transistor network simulator calculates current information of the transistor network at specified supply voltages. The power net simulator uses the currents calculated in the transistor network simulation to calculate node voltages and branch currents in the power net. The node voltages and branch currents are used for checking voltage drops, current densities and ground bounce. Peak voltage drops are checked against user-specified thresholds. The present invention gives designers a quick way of identifying problem areas in their IC design.
In one aspect of the present invention, a method of analyzing power nets on a computer system comprises the steps of: inputting an integrated circuit layout and netlist of an integrated circuit, the integrated circuit including integrated circuit devices; with the circuit netlist, simulating operation of the integrated circuit to a series of logical input vectors at specified supply voltages; extracting a power net netlist from the circuit layout, the power net netlist including at least one power pad and at least one integrated circuit device connection; determining current at selected integrated circuit devices electrically connected to a power net specified by the power net netlist; with the power net netlist, simulating operation of the power net according to current at the selected integrated circuit devices to determine a characteristic of portions of the power net; displaying a layout representation of the power net on a display of the computer system; and displaying the characteristic of the portions of the power net on the layout representation.
Other features and advantages of the present invention will become apparent upon a perusal of the remaining portions of the specification and drawings. In the drawings, like reference numerals indicate identical or functionally similar elements.


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