Integrated circuit packaging with improved heat transfer and red

Details Integrated circuit packaging with improved heat transfer and red Integrated circuit packaging with improved heat transfer and red

1992-08-31

1994-04-26

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 174252, 174256, 257664, 333247, 361778, 361792, H05K 720

Patent

active

053072375

ABSTRACT:
An integrated circuit packaging system with an integrated circuit die mounted onto a substrate having a top side ground plane between the integrated circuit and the substrate, a bottom side ground plane and short high frequency connections between the two ground planes. The top side ground plane decreases signal degradation due to reflections by providing high frequency ground access close to the die and by providing a transmission line for bond wires. A grid of conductive vias through the substrate improves thermal conductivity and provides the short high frequency current path for the top side ground plane. The die is separated from the top side ground plane by a dielectric layer which also has a conductive layer next the die to provide a back bias voltage.

REFERENCES:
patent: 4617586 (1986-10-01), Cuvilliers et al.
patent: 4768004 (1988-08-01), Wilson
patent: 4839717 (1989-06-01), Phy
patent: 4925024 (1990-05-01), Ellenberger
patent: 4949163 (1990-08-01), Sudo
patent: 4953001 (1990-08-01), Kaiser, Jr.
patent: 5057805 (1991-10-01), Kadowaki
patent: 5083236 (1992-01-01), Chason
patent: 5184210 (1993-02-01), Westbrook

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