Integrated circuit packaging systems with double surface heat di

Details Integrated circuit packaging systems with double surface heat di Integrated circuit packaging systems with double surface heat di

1985-10-09

1986-10-28

James, Andrew J.

357 71, 357 67, H01L 2336, H01L 2314, H01L 2354

Patent

active

046202153

ABSTRACT:
A mounting arrangement for a semiconductor integrated circuit chip having a first heat sink mounted to the bottom surface of the chip in good heat transfer relation and a second heat sink mounted to a region of the top surface of the chip interior to the bonding pads.

REFERENCES:
patent: 3476986 (1969-11-01), Tsuji
patent: 3626259 (1971-12-01), Torrance et al.
patent: 3651562 (1972-03-01), Hambleton
patent: 3808041 (1974-04-01), Rosenberger et al.
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patent: 4278991 (1981-07-01), Ritchie et al.
patent: 4372809 (1983-02-01), Grewal et al.
patent: 4459607 (1984-07-01), Reid
"Structure for Achieving Thermal Enhancement in a Semiconductor Package"-Miller-IBM Corp. Technical Disclosure Bulletin, vol. 23, No. 6, Nov. 1980, p. 2308.
"Microcircuit Heat Sink-Cherniak et al.-IBM Technical Disclosure Bulletin"-vol. 8, No. 10, Mar. 1966, p. 1457.

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