Integrated circuit packaging system with stacked integrated...

Details Integrated circuit packaging system with stacked integrated... Integrated circuit packaging system with stacked integrated...

2009-04-14

2011-10-18

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C257S678000, C257S706000, C257S717000, C257S720000, C257S796000, C257SE23001, C257S021000

Reexamination Certificate

active

08039316

ABSTRACT:
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.

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