Integrated circuit packaging system with package-on-package...

Details Integrated circuit packaging system with package-on-package... Integrated circuit packaging system with package-on-package...

2011-06-28

2011-06-28

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S778000, C257SE21052

Reexamination Certificate

active

07968995

ABSTRACT:
A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base substrate; mounting a second base integrated circuit over the first base integrated circuit; attaching a stacking interconnect to the base substrate and adjacent to the first base integrated circuit; and forming a base encapsulation, having a recess portion from a corner of the base encapsulation and a step portion adjacent to the recess portion, with the step portion over the second base integrated circuit and the recess portion exposing the stacking interconnect.

REFERENCES:
patent: 7061103 (2006-06-01), Chen et al.
patent: 7518224 (2009-04-01), Shim et al.
patent: 7812435 (2010-10-01), Park et al.
patent: 2006/0256525 (2006-11-01), Shim et al.
patent: 2007/0190690 (2007-08-01), Chow et al.
patent: 2009/0057861 (2009-03-01), Park et al.
patent: 2009/0057864 (2009-03-01), Choi et al.

Affiliated with

Also associated with

Rating

Integrated circuit packaging system with package-on-package... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit packaging system with package-on-package..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit packaging system with package-on-package... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2711563